junction-to-ambient thermal resistance R_{θ J-A}: (°C/W)
junction-to-case thermal resistance R_{θ J-C}: (°C/W)
Power Dissipation: (W)
Device maximum operating temperature: (°C)
Application maximum operating temperature: (°C)
Heat Sink Required:
Maximum Heat Sink thermal resistance (R_{θ C-S} + R_{θ S-A}):